Thermal Grizzly Hydronaut Thermal Paste 1 Gram
Thermal Grizzly Hydronaut 1 g is a non-electrically-conductive thermal paste supplied in a one-gram package with an application spatula. It provides a silicone-free formulation designed around medium and large heat-transfer surfaces, with no curing period required.
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Overview
THERMAL GRIZZLY HYDRONAUT 1 G

Silicone-Free Thermal Paste for Larger Contact Surfaces
Thermal Grizzly Hydronaut 1 g is a non-electrically-conductive thermal paste supplied in a one-gram package with an application spatula. It provides a silicone-free formulation designed around medium and large heat-transfer surfaces, with no curing period required.
Package quantity
Electrical conductivity
Density
Included application tool

A Thermal Interface Between Two Surfaces
Thermal paste fills microscopic gaps between a processor contact surface and the cooler contact plate. Thermal Grizzly Hydronaut 1 g is intended for that interface, helping establish the thermal path when the cooler is fitted correctly. It is a paste application rather than an adhesive, structural filler or replacement for proper mounting pressure.
The Formulation and Its Intended Use
Hydronaut uses a silicone-free carrier structure and is specifically developed for medium and large heat-transfer surfaces, including suitable water-cooling applications. Its flexible structure is intended to support straightforward application, giving the paste a role in demanding cooling systems and compatible industrial uses.
No Electrical Conductivity
Thermal Grizzly lists an electrical conductivity of zero pS/m for this paste. That distinguishes its electrical behaviour from conductive liquid-metal compounds. Apply it only to the intended contact surface and follow the hardware’s installation guidance; a non-conductive formulation does not make uncontrolled application around sockets or small components a useful installation method.
One-Gram Package with an Application Spatula
The TG-H-001-RS package contains one gram of paste and the TG Spatula for application. Match the amount to the processor and cooler surface rather than assuming a fixed number of applications from the package. Surface size and application method determine how much material is needed for each completed installation.
No Curing Period Required
The formulation does not require a curing period. Prepare the contact surfaces and fit the cooler according to the relevant hardware instructions before operating the system. When replacing an existing application, clean away the previous material appropriately and use fresh paste rather than combining unrelated compounds on the contact area.

Model
Thermal Grizzly Hydronaut 1 g
Manufacturer part number
TG-H-001-RS
Package quantity
1 g
Material Ratings and Cooling Expectations
The published paste working-temperature range is -200 to +350°C, with a density of 2.6 g/cm³. Those values describe the thermal-interface material, not a permitted processor operating temperature or a promise of a particular temperature reduction. Choose the cooling system and operating limits around the actual processor and its supported installation.
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Frequently Asked Questions
Is this liquid metal?
No. It is a non-electrically-conductive thermal paste.
How much paste is supplied?
One gram in the TG-H-001-RS package.
Is an applicator included?
Yes. The manufacturer package includes a TG Spatula.
Does it need to cure?
No curing period is required.
Does the material temperature rating describe a CPU limit?
No. Follow the processor’s own operating limits and the cooler installation guidance.
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THE DETAILS
Technical specifications
Product Specifications
Thermal Grizzly Hydronaut 1 g
TG-H-001-RS
1 g
TG Spatula included
Grey
0 pS/m; non-electrically conductive
-200 to +350°C
2.6 g/cm³
No curing period required
A silicone-free formulation designed around medium and large heat-transfer surfaces
COMPLETE YOUR SETUP